Intel Inc. is conducting an interview for the post of Package Design Engineer.
In this position, you will be responsible for executing package designs across Intel’s product portfolios (CPUs, Chipsets, SOC designs and more) as part of the Assembly and Test Technology Development group. The job will require the candidate to Understand packaging technology development FMEAs and product packaging requirements – both physical and electrical. You will be directing technical aspects of the Package design process including conducting early route studies, creation of specifications, providing guidance for electrical analysis and supervision of production layouts. Job function also involves managing design schedules, conducting design reviews and guide in package tape out process. As Package design engineer, the successful candidate will also work closely with other stakeholders from different organizations within the company to incorporate their inputs into the package design. The job scope also includes post design validation data analysis to understand the packaging impact to product performance, yield and reliability. The candidate would need to have the ability to learn and adapt to multiple CAD tools and other design software applications and develop robust and optimal design solutions through CAD layout using package design tools that meet all stakeholder requirements.
You should possess a Masters or Bachelors in Electrical Engineering/ Chemical Engineering/ Mechanical Engineering or Material Science.
Additional qualifications include:
- Solid background in semiconductor fabrication and packaging
- Basic knowledge or experience of CAD tools used for Package and Board design
- Experience and knowledge with assembly process, test and characterization techniques would be an added advantage
Job/Req. ID: JR0126574
Company: Intel Inc.
Location: Bengaluru, KA