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Job description:
Micron technology is looking for the post of the Mechanical Simulation Engineer.
Job duties and responsibilities:
- Solid knowledge through academic coursework or experience required in thermo-mechanical modeling and measurements of semiconductor packaging and/or PCB assemblies.
- Through knowledge on Mechanical Shock, Drop, SJR and Thermal Stress concepts.
- A strong background in mechanical and thermal sciences with emphasis on both analytical and measurement methods.
- Thorough knowledge of material properties and material property test methods.
- Working knowledge through academic coursework or experience in numerical simulation of material and structural behavior (non-linear deformation, viscoelastic behavior, etc.).
- Working knowledge in applying Finite Element Modeling (FEM); and familiarity with software tools such as ANSYS (APDL & Workbench).
- A good understanding of semiconductor packaging processes and materials and technology and trends such as PCB design and manufacturing, molding, wire-bonding, die attach, etc.
- A good understanding of semiconductor package reliability and defects; solder-joint reliability, warpage, etc.
- Strong oral and written communication skills.
- Demonstrated strong work ethic
Qualifications and experience required:
Degree required: MS/M.Tech or PhD
Experience: 0 – 8 Years
M.Tech/MS Freshers from IIT/NIT and other reputed universities are also eligible to apply.
Job/Req. ID: JR61150
Company: Micron Technology
Location: Hyderabad, Telangana
Job Category: VLSI Engineering
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