Job description:
Qualcomm is looking for Thermal Engineers.
Duties and responsibilities:
As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.
Qualifications required:
Bachelor’s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.
Job function:
- Thermal analysis of Advanced packaging (2.5/3DIC, chiplets) to contribute in cutting edge pkg solution in datacenter and compute domain
- Thermal analysis methodology development: encompassing SoC, package and systems, for various Qualcomm products going into smartphones, laptops, automotives and virtual reality headsets.
Skills:
- Knowledge of Advanced packaging (2.5/3DIC, chiplets) OR hands on experience in Thermal Measurement
- Should possess strong analytical skills and mathematical modeling abilities.
- Good knowledge of scripting in PERL/Python required
- Some exposure to Machine Learning algorithms/frameworks will be a plus.
- Need to have thorough knowledge of heat transfer mechanisms and CFD.
- Proficiency with state-of-the-art thermal analysis tools – Ansys Icepak/Flotherm
Experience: BE/ME graduates with 1 to 3 years of experience
Job/Req. ID: 3069288
Company: Qualcomm
Location: Bangalore, KA
Job Category: Computer Science or Electronics or Electrical Engineering
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