Job description:
Sandisk is looking for a Staff Engineer.
The Staff Packaging engineer will be an individual contributor and should be able to perform package design related to flash memory products
- As a IC packaging engineer, you will work in the Packaging R&D group on package deign, modeling and simulation across semiconductor packaging, flash memory product, and host levels. ( mainly on BGA / system in packages )
- In this position, you will be responsible for influencing package and product design and advancing the technology of semiconductor packaging generally.
- Scope is to address all design aspects of packaging technology and associated material and process interactions.
- Knowledge of semiconductor assembly process is required ( back grinding , dicing , Die attach, wire bonding, molding, laser marking, laser cutting, singulation, solder ball attach, reflow, SMT, testing )
- Higher Die stacking and its wire bonding / molding concept to be known
- Focus will be on solutions to meet increased demands for small form factor packages with thinner chips, denser interconnects and higher power.
- Candidate will be responsible for the modeling and simulation of mechanical responses of the IC package and flash products using analytical and computational tools.
- Working knowledge on AI/ML, data science must
- This position will interface with package & product design, electrical and physical characterization, lab testing, failure analysis, assembly R&D and other process teams.
- Interacting with internal engineering departments, vendors and customers to develop high performance leadership package
- Ability to daily multi-tasking in different projects, manage and meet tight deadlines of packaging deliverables as a part of multidisciplinary team as well as excellent communication and interpersonal skills required.
- Knowledge of Package signal integrity and power integrity principles would be good. Knowledge of EMI, HFSS, HSPICE is a plus. Hands-on with oscilloscopes, network analyzers and spectrum analyzers also a plus
- Skills in AutoCAD, Cadence APD, Finite Element Analysis, Design of Experiments, statistical techniques and package failure analysis techniques are good.
Qualifications required:
- B.Tech or M.Tech in mechanical / microelectronics / mechatronics / Thermal/ electronics engineering
- Solid knowledge through academic coursework subjects
- Background in applied mechanics with emphasis on both analytical and computational methods.
- AutoCAD must
- Broad knowledge of mechanical behaviours of various material types, such as ceramics and glass, polymers, and metals (e.g., solder).
- Strong oral and written communication skills.
- Demonstrated strong work ethic.
- Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development.
Job/Req. ID: N/A
Company: Sandisk
Location: Bangalore, KA
Job category: Electronics or Mechanical or Microelectronics or Mechatronics or Thermal Engineering
Do you want Job alerts on your Phone? Join our WhatsApp/Telegram Group
